Microelectronics Show Tokyo 2019

About Microelectronics Show Tokyo 2019

2019-06-05 12:00:00 2019-06-07 12:00:00 Europe/London Microelectronics Show Tokyo 2019 33rd Advanced Electronics Packaging Exhibition Big Sight, Tokyo Big Sight Eventegg info@eventegg.com

33rd Advanced Electronics Packaging Exhibition is organized to start on 05 Jun and end on 07 Jun 2019.

The scene of the Exhibition will be Tokyo Big Sight which is one of the wonderful location for such an essential event.

Microelectronics Show Tokyo 2019 is to be a stage where several noteworthy solutions and products tend to be put on show. These will be about Electronics Industry, Electronic Circuits and Electronics Packaging.

Microelectronics Show Tokyo 2019 is an annual Exhibition.

With 120000 expected attendees, Microelectronics Show Tokyo 2019 is a noted event on Packaging Materials areas.

The association of the 33rd Advanced Electronics Packaging Exhibition is Japan Electronics Packaging and Circuits Association.

When you are in Tokyo for Microelectronics Show Tokyo 2019, discover these three must visit places and fall in love with the charm of this city:

Exhibitor Profile

Leading-edge products based on high-density or high-frequency packaging technologies
high-density substrate and interposers
component contained boards
semiconductor chips
systems in package (SiP)
systems on chip (SoC)
indication/optical devices and sensors
materials related to high-density packaging
pastes
lead-free solder and junction materials
sealing resins
adhesives and underfill materials
anti-heat materials
high frequency ready polymer
systems and devices related to high-density packaging such as bonders (e.g. wire bonders, die bonders, and LCD/COG bonders)
dispensers
flip chip (FC) packaging
BGA/CSP assembly
TAB packaging
OLB/ILB systems and COB systems and equipment and production facilities
related books