IC & Sensor Packaging Technology 2018 will be between 17 Jan and 19 Jan 2018.
The location of the Exhibition will be Tokyo Big Sight which is one of the fantastic venue for such an essential event.
IC & Sensor Packaging Technology 2018 may be a medium where many highly recommended products and solutions are exhibited. Several of these tend to be about Packaging Technology, Packaging Materials, Packaging, Packaging Components and Manufacturing.
19th Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services is an annual Exhibition.
The organizer of the IC & Sensor Packaging Technology 2018, 19th Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services is Reed Exhibitions Japan Ltd..
When you are in Tokyo for IC & Sensor Packaging Technology 2018, explore these three must visit places and fall in love with the charm of this city:
Held inside NEPCON JAPAN.
- Semiconductor Manufacturers
- Assembly Manufacturers/SATS
- Sensor Manufacturers
- Set Manufacturers (in high-density SMT)
- MEMS Devices/LED Manufacturers
- Automotive Electronics Manufacturers
- Assembly Equipment
- Packaging Materials/Components
- Analysis/Simulation Software for IC Packaging
- Various Packages
Tokyo Big Sight
Address : 3 Chome-11-1 Ariake, Kōtō-ku, Tōkyō-to 135-0063, Japan