The Congress is organized between 10 Sep and 13 Sep 2017.
The Congress location is Warsaw University of Technology in Warsaw, Poland.
Bringing industry and academia together, 21st European Microelectronics and Packaging Conference & Exhibition is a 4 days event on Packaging Technology, Microelectronics, Packaging, Printing and Labeling fields. It also suggests you the convenience for face-to-face cooperation with those driving the future.
21st European Microelectronics and Packaging Conference & Exhibition is organized biennially.
The association of the 21st European Microelectronics and Packaging Conference & Exhibition is International Microelectronics Assembly and Packaging Society.
Let Warsaw must do holiday attractions make you fall in love with this city when you are there for EMPC 2017. Here are top notch things to do in Warsaw!
Venue
Warsaw University of Technology
Address : Witolda Wierzbickiego, 00-664 Warszawa, Poland
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