Event Type: Trade Show, Fair and Exhibition
Categories: Packaging Technology, Packaging, Packaging
NCIEC - New China International Exhibition Center Click for map & venue info
BIP 2014, Beijing International Packaging Fair is going to be organized from 30 June, 2014 to 02 July, 2014.
The Trade Show, Fair and Exhibition is located at the New China International Exhibition Center.
You've got the chance to get the newest advances in Packaging Technology, Packaging and Packaging at this essential Trade Show, Fair and Exhibition.