Event Type: Fair and Exhibition
Categories: Packaging Technology, Packaging, Packaging Industry
NCIEC - New China International Exhibition Center Click for map & venue info
BIP 2014, Beijing International Packaging Fair is starting on 30 June, 2014 and ending on 02 July, 2014.
The Fair and Exhibition location is New China International Exhibition Center.
BIP 2014 will probably be the base where lots of essential products will be presented. Several of these are generally Packaging Technology, Packaging and Packaging Industry.